WR

William Rice

Vice President at Rice Packaging

Greater Boston

Overview

Work Experience

  • Vice President

    2023 - Current

  • Board Observer

    2019 - 2023

  • Board Observer

    2018 - 2023

  • Venture Investor - Bose Ventures, Corporate Development Manager

    2016 - 2023

  • New Product Strategist - Emerging Businesses

    2015 - 2016

  • Board Observer

    2018 - 2022

  • SVP Engineering

    2013 - 2015

    Founding team member of San Diego-based startup focused on the home automation market. Through patented technology and innovative engineering design, Green Edge Technologies developed and brought to market EDGEhome, a unique energy management and home automation system. Responsible for hardware product development: • New product development, from product requirements definition to commercialization. • Product roadmap definition and portfolio planning. • Electronics design and development: Schematic capture, PCB design, DVT. • Electro/Mechanical design & Mechanical packaging: Significant experience packaging integrated electronic technologies with challenging and complex mechanical constraints.

  • Product Manager

    2011 - 2013

    TORCOMM developed a multi-platform (Android, iOS, OS X, Win) and multi-device (Smartphone, Tablet, PC) cloud storage software service. • Responsible for developing business model and monetization strategy for cloud storage software platform. • Analyzed market opportunities, which included market analysis and competitive analysis to determine feasibility and economic viability of the consumer software platform. • Developed and refined financial models and projections based on revenue and cost analysis. • Created investor pitch decks and materials to support funding activities. • Formulated product definition (PRD, MRD) including product strategy, functionality, features, and user interface.

  • Principal Staff Engineer

    2009 - 2011

    • Electrical lead on an Android based CDMA/GSM/UMTS mobile handset that launched at Sprint in May 2011. • Launched two Boost Mobile CDMA mobile handsets for Boost Mobile in Q2 2010. • Scoped development effort, complied marketing requirements documents, wrote technical requirements specification, and created design validation plan. • Responsible for EE schedule, design validation plan execution, carrier deliverables, and regulatory certification compliance. • Managed our ODM EE design team from design phase through mass production and product launch.

  • Sr. Staff Electrical Engineer

    2008 - 2009

    • Worked on a small EE team developing new wireless office products. • Responsible for the schematics and component level design of 2 advanced ARM9 micro-processor systems that interfaced to a variety of communication systems, including multiple wireless communication systems as well as SDRAM, FLASH, SD Card, and USB. • Worked closely with ME to resolve issues pertaining to floor planning, placement and partitioning of PCBs in both the fixed and headset units.

  • Sr Electrical Engineer

    2005 - 2008

    • EE lead on a QSC6075-based tri-band CDMA handset. Responsible for all electronics in the upper half of phone, including component selection, schematics, PCB and FPC layouts, and verification. • Led 20+ person cross-functional team to implement new technology into a phone. Team included electrical, mechanical, software and manufacturing engineers. • Schematic owner of WiFi/CDMA combo phone. Drove design and schematic reviews, specified components, and provided factory support at prototype builds. • Led cross-functional engineering team for the qualification of a 2nd source display on CDMA RAZR phone. Successfully mitigated a 1.3 million display shortage which accounted for $250M of revenue in 4Q06. Effort included travel to suppliers and manufacturing facilities in China to oversee prototype builds from display module level assembly to final prototype assembly.

  • Electrical Engineer Co-op

    2001 - 2005

    Engineering co-op (intern) on four different 6-month assignments (2+ years of full time work experience). Worked in the New Ventures Group, the Electrical Analysis & EMC Group, and the Automotive Systems Division. Performed a number of tasks including testing, spec writing, firmware development, prototyping and design work.

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